Sanket Goel, Dean (R&I), BITS Pilani, with Alexander Varghese, COO, UST, at the signing of the MoU held at the UST campus in Thiruvananthapuram.

Sanket Goel, Dean (R&I), BITS Pilani, with Alexander Varghese, COO, UST, at the signing of the MoU held at the UST campus in Thiruvananthapuram.

Leading digital transformation solutions company UST has signed a Memorandum of Understanding with BITS Pilani for multi-dimensional partnership with one of India’s reputed higher learning institutions to promote academia-industry collaboration.

The MoU will focus on advanced research and co-creation in photonics; quantum computing; VLSI; humanoid robotics; artificial intelligence; and med-tech, a company spokesman said. Patents, Proof-of-Concept projects, and market-ready products will be developed under shared guidance of UST’s engineering experts and BITS Pilani’s academic leadership.

Co-developing research

Among those present on the occasion MoU signing were Alexander Varghese, COO; Gilroy Mathew, Senior Vice-President and Global Head of Engineering; and Shilpa Menon, Centre Head, Thiruvananthapuram for UST. Sanket Goel, Dean (R&I), and Praloy Mondal, Programme Manager, CREST (Centre for Research Excellence in Semiconductor Technologies), represented BITS Pilani.

UST will co-develop research programmes aligned to pressing industry problems; provide technical mentorship; enable prototyping infrastructure; and support commercialisation of innovation outcomes. Areas of cooperation also include semiconductor testing; data-driven engineering; cloud computing; sustainable technologies; and AI-powered industrial solutions.

BITS Placement Cell

UST will additionally engage with the BITS Pilani Placement Cell to recruit emerging talent while participating in curriculum design and faculty development efforts. This partnership will leverage the BITS Pilani’s AI ecosystem to co-develop market-ready solutions, upskill talent, and advance India’s automotive and robotics sector.

Gilroy Mathew, Senior Vice President and Global Head of Engineering, UST, said this collaboration will offer a platform for students and faculty to engage in meaningful and industry-aligned innovation. “We believe this MoU will help nurture talent, exposing them to next-generation technologies and translating research into real-world outcomes,” Mathew added.

Real-world challenges

Sanket Goel, Dean (R&I) BITS Pilani, said this MoU is a significant step toward strengthening connection between academia and industry. “Collaborating with UST will give our students and faculty valuable exposure to real-world challenges and emerging technologies. This partnership will not only foster innovation but also enhance practical learning experience for our students, equipping them with skills needed to thrive in a rapidly evolving tech landscape.”

With deep expertise across semiconductor design; software-defined mobility; smart manufacturing; and immersive technologies, UST has been delivering AI-integrated solutions from chip to cloud., the company spokesman said. These capabilities will combine together to position the company as a global leader in delivering adaptive, next-generation engineering solutions.

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Published on July 31, 2025

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